Mechanic QC20 BGA-IC Super Glue Remover Agent 20ML

Product Features :-

\n
• 20ml BGA IC glue epoxy remover.
\n
• Can help you soften & remove resinating / sealing glue of chip BGA IC of mobile phones easily.
\n
• quickly soften and loosen solidified resin adhesive such as epoxy, phenolics, acrylate, polyurethane, organosilicon etc.
\n
• It won't do harm to your circuit board and components. Environment friendly and safe.
\n
• Doesn't contain any Benzene Coderivative substances with cause leukaemia. Convenient to use
\n

How to Use :-

\n
• Pick an bigger size absorbent cotton than BGA IC with a tweezers and dip into the removing liquid. Then cover it evenly on BGA IC chip which in need of glue removing.
\n
• Place a plastic bag or film on the top and cover the PCB board.
\n
• Wait for about 20 minutes.
\n
• Redo step 1 to step 3
\n
• To remove the softened sealing glue in the outside of BGA IC chip with a tweezers. Please pay attention to avoid damaging routes surrounding BGA and copper foil circuit around main board when removing the glue.
\n
• Heat up the chip with a air tool (300 deg.C). The glue in the bottom will get melt and soften by heat.
\n
• To remove the chip with a tweezers or cutter
\n