Black Android Stencil BGA Reballing For MT6797 CPU Qianli-QL11 \n

your soldering and reballing precision with this high-quality stainless steel stencil, designed for precise application of solder paste to PCB pads. Whether you're repairing a mobile phone motherboard, gaming console, or any BGA chip, this stencil ensures accurate solder deposition for a flawless connection. ? High-Precision Apertures ? Designed for perfect alignment with PCB solder pads, ensuring uniform solder application.

\n? Premium Stainless Steel Build ? Resistant to heat, warping, and corrosion, making it ideal for long-term use. \n \n? Versatile Usage ? Perfect for solder paste application during surface-mount device (SMD) assembly and BGA reballing. \n \n? Compatible with Specific Models ? Ensures a perfect fit for various chipsets and circuit boards.?? Ensures Stronger Solder Joints ? Reduces errors and rework, ensuring a professional-grade soldering job. \n \n?? Increases Work Efficiency ? Speeds up solder paste application, improving repair accuracy. \n \n?? Trusted by Technicians ? Preferred by experts in mobile and electronics repair for its consistency and precision. 1?? Place the stencil over the PCB/component. \n \n2?? Apply solder paste evenly using a scraper. \n \n3?? Remove the stencil carefully to reveal the paste-applied pads. \n \n4?? Proceed with reflow soldering for a secure bond.