Description
W110+ BGA Repair Blade Set Motherboard IC Opening Blade
Product Features :-
- Application Phone BGA Chip Remover Blade is a commonly used disassembly tool for small and slightly smaller IC parts on the motherboard of the mobile phone. Mainly Used to remove CPU chips, repair the motherboard.
- Work efficiently High precision hand tools, easy to use, which improve your work efficiently. Heat resistance, low-temperature resistance, and good toughness.
- Easy to use Perfect phone OCA Glue cleaning tool for iPhone motherboard and LCD screen. Ultra-thin blades will offer the best solution to pry out the chip easily without any damage.
- 27 in 1 This repair tool set includes 27 different shapes of blades and 1 handle are available to meet your various needs. 27 Different angles can ensure you can use it in any direction, it will not lead to any inconvenience during your phone repair work.
- Alloy steel The Chip Demolition Repair Tool is Made of high-quality alloy steel, never drop point, not peeling copper, easy to clean.
- This tool has been made thinner than the tin point to allow free movement between the chip and the bottom of the board
