Description
Qianli Middle Frame BGA Reballing Platform for iPhone 13-13 Pro Max Middle Layer Logic Board Relaying Lead Template
Feature :-
- The mega-idea multifunctional Reballing Platform supports Series 13 to 13 Pro Max
- Applicable to Mega-idea multifunctional mid-frame Reballing Platform used with base will update more models
- Replace and add updated models for more expansion
- Models keep updating, adding unlimited, free from base replacement
- CNC high-precision one-piece machining, motherboard stable positioning, not tilting when rewinding
- Non-slip footbed, two non-slip silicone footbeds, avoiding slippery when reballing
- Detailed process in every step of reballing, securely clamping the motherboard in high temperature
- Avoid large mesh areas at the same time, so that the solder paste is carried away
Specification :-
- Product: Mega-idea multifunctional mid-frame Reballing Platform
- Function: Motherboard repair and reballing
- Material: synthetic stone
How to use :-
- Precise positioning Motherboard installation, place the motherboard on the positioning column according to the model, and place it on the synthetic stone reballing platform
- Place universal on base of platform reballing and install magnet on base of platform reballing
- Place the appropriate stencil model on the appropriate reballing platform, and attach it to the magnetic base
- Apply the low temperature solder paste evenly on the stencil mesh
- After applying the paste, remove the stencil, do not use a hot air gun to blow directly on the stencil
- After removing the stencil, use a hot air gun to heat it up again, and blow on it until the paste melts
