Description
Mechanic IT3 Pro Temperature Control Preheating Platform For X To 14PM With 7/IX7 CPU NAND IC Chip Planting Heating Platform For iPhone Free Combo Pack
IT3 Pro Preheater Features :-
- Used for iPhone motherboard layered and fitting, tin planting, BGA desoldering, IC glue removal, dot matrix Face ID repair, rear camera repair
- Intelligent adjustable temperature, modular design
- No air gun and no soldering iron, just plug and use
- Multiple combination modules, good scalability, easy to expand new modules.
- Host size: 12*14cm
- Voltage 110V/220V
- Layering, tin planting, bonding, desoldering, and glue removal is integrated, and it is equipped with controllable temperature/module expansion design / no air gun and no soldering iron I plug and play technology
- Intelligent adjustable temperature, custom debugging temperature, debugging temperature according to different melting points
- No air gun, no soldering iron, fast and accurate layered tin planting in 3 minutes to fit the motherboard
- Modular design, multiple combination modules, good scalability, easy to expand new modules
- Plug and play technology, the device supports hot-swap, making your work more efficient
- Suitable for iPhone X/XS/XS Max/11/11Pro/11 Pro Max/12/12 Pro/12 Pro Max/12 Mini/13/13 Mini/13 Pro/13 Pro Max/14/14 Plus/14 Pro/14 Pro Max
7/IX7 Nand IC Preheater Features :-
- Universal chip tin planting and glue removal are the main function of this product.
- The original positioning steel plate and the strong magnetic base make the four-corner positioning and fast positioning come true, prevents displacement.
- The groove design is convenient for the maintenance master to remove the glue.
- Constant temperature 185?? degrees, make it’s possible for you to quickly solve all problems of tin planting and glue removing in three minutes.
- Preheating in constant temperature without air gun soldering iron, host, plug.
- Portable fast heating.
- CPU EMMC Nand IC A8 A9 A10 A11 A12