ChipQuik LT4258HX50T3 is a high-performance, lead-free, no-clean solder paste designed for precision electronics assembly and rework

Product Featutres :-

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• Low Melting Point: Melts at 138°C (281°F), reducing the risk of thermal damage to delicate components.
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• Alloy Composition: Sn42/Bi58. offering excellent wetting and joint strength.
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• Flux Type: Synthetic No-Clean (REL0), leaving minimal residue and eliminating the need for post-solder cleaning.
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• Particle Size: T3 mesh (25–45 µm), suitable for fine-pitch components and precise applications.
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• Metal Content: 90% by weight, ensuring consistent solder joints.
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• Packaging: Available in a 50g.
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