Description
AiXun lead free solder paste has different types in melting points so as to satisfy various soldering needs. The SP-138 degree low temperature paste is a special solder consumable that can be applied to iPhone X/XS/XSMAX middle frame and mainboard tin planting, the lead-free and silver containing formula is benefit for environmental protection. The tin balls it creates are delicate, round and full. It has a good viscosity, no blistering and even no solder bead. The SP-138 degree medium temperature nano flux paste is more suitable for welding and maintenance of after-sales mobile phone motherboard, nano chip, BGA, SMT reballing. It has a strong tin climbing ability, good conductivity and strong tin load capacity, which enables no rework after planting balls.
• 138℃: lead free material, support soldering under low temperature, environmental protection
• Silver containing formula, good viscosity, no blistering and solder bead
• Good conductivity and strong tin loading capacity, no residual, no clean, user-friendly, no need to rework ball planting
• Composed of thousands of precise nanoparticles, specially designed for mobile phone maintenance
